At the Huawei Connect 2025 conference, the company officially unveiled the latest chip roadmaps for its Ascend and Kunpeng series, while also announcing expanded partnerships with multiple listed firms to accelerate AI applications and embodied intelligence.
Several publicly listed companies, including Landray Software, Hundsun Technologies, Newsoft Technology, Kingsoft Office, Advanced Digital China, iFlytek, Sangfor, and Zhiyang Innovation, introduced integrated large model application machines built on Ascend and Kunpeng ecosystems. Huawei also revealed plans to jointly work with Hundsun Technologies, Newsoft Technology, Comba Information, CloudWalk Technology, and others to drive AI penetration in core industries.
Huawei Cloud Introduces First Batch of Partners for Embodied Intelligence R2C Protocol
Huawei Cloud announced its first batch of partners under the Robot-to-Cloud (R2C) protocol, which aims to establish a unified, open, and secure communication bridge between robots and the cloud. This enables collaborative intelligence and efficient execution.
The R2C protocol has already initiated three national standards for data collection, data generation, and communication interfaces. Twenty founding partners, including Hualong Xunda, Flexiv, Efort, Daohotongtai, and others, will collaborate with Huawei to develop integrated cloud-robotics solutions for manufacturing, logistics, inspection, and eldercare.
Huawei Cloud is also introducing its CloudRobo embodied intelligence platform to innovation hubs in Shenyang and Wuxi. Demonstrations at the conference included industrial robots from Hualong Xunda, Efort, and Topstar; collaborative robots from Flexiv and Huayan Robotics; compound robots from ExRobotics, Youai Zhihé, Standard Robots, Softtone SkyEngine, and Xinghaitu; humanoid robots from Shanghai Humanoid Robotics and Beijing Humanoid Innovation Center; and aerial/mobility robots from Daohotongtai, Bluecore, and Jaten Robotics.
Demonstrations showcased use cases such as intelligent inspection for the energy and transportation sectors by Daohotongtai, precision wafer box handling by Youai Zhihé, and industrial embodied robots by Standard Robots.
Ascend and Kunpeng Ecosystem Expansion
Huawei revealed updates to its Ascend and Kunpeng ecosystems. Ascend now has over 80 hardware partners, covering more than 200 scenario-specific products ranging from AI PCs and edge devices to high-density servers. These support training, intelligent manufacturing, smart inspections, and education.
New products released in 2025 include AI inference servers from PowerLeader and Kunlun, and large-model inference appliances from iSoftStone. Huawei plans to collaborate with over 20 ISVs in finance, energy, government, education, and healthcare to deepen AI integration. Partners include Hundsun Technologies, Newsoft Technology, Comba Information, Neuxnet, iFlytek, Kingsoft Office, CloudWalk, Magure, Chinasoft International, Yunhai Technology, Online Culture, Jiayuan Technology, and QuanZhen Medical.
At the event, Ascend joined forces with 26 partners to release integrated large-model appliances, adding to over 140 partners who have already launched such products deployed by more than 2,000 clients. Notably, Zhiyang Innovation introduced a geological safety multi-sensor large-model appliance designed to detect geological risks and prevent natural disasters such as floods.
Zhiyang also showcased its SF-X1 satellite-denied embodied intelligence drone, capable of operating in environments without satellite positioning, including underground cable tunnels, mines, and sewers.
On the general computing side, Li Yi, President of Huawei Kunpeng Computing, reported that Kunpeng has collaborated with over 7,000 partners to incubate more than 20,000 solutions. The openEuler OS has been deployed in over 12.6 million instances, and the openGauss database has reached 4.8 million downloads.
At the conference, InfoPower Software introduced its Kunpeng backup appliance, while iSoftStone Smart Solutions and Huawei launched three major solutions: a city-level AI super-application, an AI+ industrial park solution, and an advanced storage solution for multimodal data. The event also marked the launch of the “AI+ High-Quality Development Joint Action Plan.”
Exhibitors such as Talkweb Information, Neusoft, Yunding Technology, Huakun Zhenyu, and iFlytek also presented solutions at the event, showcasing Huawei’s expanding role in AI and intelligent computing ecosystems.
References:
- Sci-Tech Innovation Board Daily (September 20, 2025)
